Capabilities

CAPABILITIES

GREAT SERVICE • GREAT PRICING • HIGH QUALITY

CONSTRUCTION

  • Single Sided, Adhesive and Adhesive less base.
  • Single Sided dual access, Double Sided, Adhesive and Adhesive less base
  • Multi-Layer (up to 6 layers), Adhesive and Adhesive less base.
  • Rigid-Flex, Adhesive less base materials only.

LINES AND SPACES

  • Lines 0.002” and up
  • Spaces 0.002” and up
  • Pitch 0.004” and up

VIAS

  • Drilled 0.006” and up
  • Laser 0.002 and up

INSULATING MATERIALS

  • Polyimide 0.0005” and up
  • Rogers 8080 Soldermask 0.0015”
  • DuPont PIC 1025

CONDUCTIVE MATERIALS

  • Electro deposited Copper ¼ ounce to 5 ounce. ¼ oz is adhesive less base only.
  • Rolled and Annealed Copper ½ ounce to 5 ounce

ADHESIVES

  • Thermo-set Modified Acrylic
  • Pressure SensitivePressure Sensitive

STIFFENERS

  • Epoxy-Glass
  • Polyimide
  • Aluminum
  • Stainless Steel

PLATED FINISHES

  • HAL (Hot Air Level) Solder
  • Electrolytic Gold *
  • Immersion Gold *
  • Immersion Tin, White Tin*
  • Immersion Silver*
  • OSP (Organic Solderability Preservative)*